Reflow Soldering (Beta Layout kit)

Connecting to the Beta Layout Flow controller simply with screen:

screen -L /dev/ttyUSB0

The '-L' argument saves the session to a logfile.

Settings for Pb soldering:

phttemp  125 Preheat temperature: [0..254] degC
phttime  150 Preheat time: [0..65534] Sekunden
phtpwr   60 Preheat power: [0..100] %
soaktemp  180 Soak temperature: [0..254] degC
soaktime   90 Soak time: [0..65534] Sekunden
soakpwr   80 Soak power: [0..100] %
reflowtemp  230 Reflow temperature: [0..254] degC
reflowtime  140 Reflow time: [0..65534] Sekunden
reflowpwr  100 Reflow power: [0..100] %
dwelltemp  232 Dwell temperature: [0..254] degC
dwelltime   40 Dwell time: [0..65534] Sekunden
dwellpwr   80 Dwell power: [0..100] %
tempoffset-  10 temperature adjust [-30..30] deg
debug OFF output debug information [0 or 1]
trace OFF output internal status information [0 or 1]
settings   0 select the active parameter set [0..4]

Settings for Sn96.5Ag3Cu0.5 soldering

• Same, but reflowtemp=245;